What Is BGA?
Ball Grid Array — the chip packaging used on phone logic boards.
Definition: BGA (Ball Grid Array) is the packaging method used for most chips on a phone’s logic board. Instead of legs on the sides, BGA chips have a grid of tiny solder balls on their underside — as small as 0.1–0.3mm — that connect to corresponding pads on the board. These connections are invisible once the chip is soldered down.
Why BGA makes repairs difficult
Because BGA solder joints are completely hidden under the chip body, visual inspection is impossible — X-ray equipment or removal of the chip is required to assess joint quality. BGA chips require a hot-air rework station to remove and replace — standard soldering irons can’t be used. The chip must be lifted with precisely controlled heat to avoid damaging surrounding components, then the old solder cleaned and the pad surface prepared before a new chip can be installed.
Common BGA-related faults
Cracked BGA joints from impact: A hard drop can crack solder balls under BGA chips without any visible board damage. Results in intermittent or complete failure of that chip’s function.
Corrosion under BGA chips: Water damage corrodes exposed solder balls. Requires chip removal, ultrasonic cleaning, reballing, and reinstallation.
Related terms
→ Reballing — the process of replacing a BGA chip’s solder balls
→ Microsoldering — the technique used to work with BGA chips
→ Ultrasonic Cleaner — reaches corrosion under BGA chips
→ Logic Board — the board all BGA chips are mounted on
Board-level chip fault after a drop or water damage?
PhoneDoctor handles BGA chip removal, reballing, and replacement. Free diagnostics, no fix no fee.